IPC-2251-2001 高速电子电路封装的设计指南

Design Guide for Electronic Packaging Utilizing
High-Speed Techniques
IPC-D-317 Task Group (D-21a)
4th Working Draft
Published by IPC
2215 Sanders Road
Northbrook, IL 60062-6135
847/509-9700
Fax 847/509-9798
URL: http://www.ipc.org/default.aspx

1.0 General
1.1 Purpose The object of this document is to provide
guidelines for the design of high speed circuitry. The subjects
presented here represent the major factors that may influence a
high speed design. This guide is intended to be used by circuit
designers, packaging engineers, circuit board fabricators, and
procurement personnel so that all may have a common
understanding of each area.
1.2 Scope The goal in electronic packaging is to transfer a
signal from one device to one or more other devices through a
conductor. Considerations include electrical noise,
electromagnetic interference, signal propagation time, thermomechanical
environmental protection, and heat dissipation.
High-speed designs are defined as designs in which the
interconnecting properties effect circuit function and require
consideration. Every electrical concept has relevant physical
implementation data and limitations provided to match the
electrical and mechanical relationships. This guideline
presents first order approximations for each of the subject
areas covered. If more detail is required, the papers presented
in the bibliography may provide more detailed supplemental
data.
IPC-2251-2001 高速电子电路封装的设计指南.pdf