倒出封装出现 *** being dumped问题

ad*** · 发表于 2012-9-9 06:55:23

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倒出封装出现 *** being dumped问题
一绘制好的＊．brd印制版－－(老版本绘制的，前用DB Doctor工具打开)，从其中倒出其封状出现一系列ERROR:大致如下...................

** Creating padstacks. ***

HOLE84 being dumped.

TH2X2C being dumped.

* being dumped.

ERROR: creating padstack: *

TH63X63 being dumped.

..................

VIA being dumped.

RECT110X84 being dumped.

*** Creating package symbols (.dra and .psm) ***

iccard being dumped.

jumper2 being dumped.

smd0805ok being dumped.

dip1 being dumped.

dip10 being dumped.

*********************** Summary *********************
ERRORs reported: 1

Number of padstacks dumped: 46
Number of package symbols dumped: 5

Total number of symbols dumped: 5

此倒出的封装是否可用,大概不可用吧,要怎么修正下,才可以倒出正确的封撞?请高手帮忙指点,谢谢!